Thermal Parameters for the thermal analysis
Thread Summary
The user requested thermal parameters (θJA, θJC, θJB) for the ADAU1761BCPZ and ADSP-SC584 ICs. The final answer indicates that the request is beyond the forum's scope and should be addressed via email due to the involvement of multiple internal groups. The ADSP-SC584 datasheet advises against using JEDEC thermal parameters for application-specific thermal estimates.AI Generated Content
Hi team,
In our development project, we are using following ICs and we need to do the thermal analysis for the PCB. For the analysis, we require the θJA (°C/W), θJC (°C/W), θJB (°C/W) thermal parameter values. Kindly provide them for the following IC's
1.)ADAU1761BCPZ
2.)In addition to this we are using the ADSP-SC584 as well, for this IC thermal parameters they have mentioned in the below manner in the datasheet:
The use of JEDEC JA, JC , or JT thermal parameters for application system thermal estimates is not recommended as
indicated in the JEDEC51 specifications:
“This methodology is not meant to and will not predict the performance of a package in an application-specific environment."
Thanks & Regards
Pullarao Chilakala
BEL
Audio Signal Processors
hardware
codec
Processors and Microcontrollers
adsp-sc589
pcb
SigmaDSP Audio Processors
adau1761
SHARC Audio Processors/SoCs
Heterogeneous Multicore Processors
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Hello pullarao,
This question is beyond the scope of the forum. Reliability engineers needs to get involved and you also are asking about parts that are covered by two different internal groups so this needs to be done via email.
I will send an email.
Dave T
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